Due to its high co-firing temperature, the choice of metal conductor materials is limited. Therefore, HTCC must be dried and hardened at a high temperature of 1300 ~ 1600 ℃. The main difference is that HTCC's ceramic powder is not added to glass materials. The manufacturing process is very similar to LTCC. HTCC is also called high temperature co-fired multilayer ceramic. According to the manufacturing processġ).HTCC (High-Temperature Co-fired Ceramic) However, as the economy improves and technology upgrades, this bottleneck will eventually disappear.īased on the above reasons, it can be known that alumina ceramics are still in a dominant position in the fields of microelectronics, power electronics, hybrid microelectronics, and power modules due to their superior comprehensive performance, and are widely used.Ģ. At present, compared to the AI2O3, the price of AlN is relatively high, which is also a small bottleneck restricting its development. Only by strictly controlling the materials and processes can we produce an AlN substrate with good consistency. The disadvantage is that even if there is a very thin oxide layer on the surface, it will affect the thermal conductivity. There are two very important properties of AlN worth noting: one is high thermal conductivity, and the other is the expansion coefficient matching Si. The most important thing is that its toxicity limits its development. It has a higher thermal conductivity than metal aluminum and is used in applications requiring high thermal conductivity, but the temperature drops rapidly after 300 ℃. It is suitable for various technical manufacturing and different shapes.
![pcb weather pcb weather](https://www.tripsavvy.com/thmb/D39NghbdXwBnrMXyKs9R_CgEros=/5220x3915/smart/filters:no_upscale()/PanamaCity-Panama-AnnaHaines63-10f0ab8066e94642beacf7910328483f.jpg)
So far, the alumina substrate is the most commonly used substrate material in the electronics industry, because of its mechanical, thermal, and electrical properties compared to most other oxide ceramics, it has high strength and chemical stability, and is rich in raw materials.
![pcb weather pcb weather](https://i.ytimg.com/vi/xBul0O-3Lp0/maxresdefault.jpg)
What are the types of ceramic substrates?
![pcb weather pcb weather](http://dangerousprototypes.com/blog/wp-content/media/2014/12/WeatherPiPopulated.jpg)
It is suitable for products with high heat generation (high-brightness LED, solar energy), and its excellent weather resistance is more suitable for harsh outdoor environments. Compared with traditional FR-4 or aluminum substrate, the ultra-thin composite substrate made has excellent electrical insulation performance, high thermal conductivity, excellent soft solderability and high adhesion strength, and can be etched various graphics like the PCB, with great current carrying capacity. Ceramic substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature.